au.\*:("BEST, Chris")
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Modelling methodology for thermal analysis of hot solder dip process : THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMSSTOYANOV, Stoyan; BAILEY, Chris; ALAM, M. O et al.Microelectronics and reliability. 2013, Vol 53, Num 8, pp 1055-1067, issn 0026-2714, 13 p.Conference Paper
